MICROCIRCUIT,DIGITAL

5962FSC

01NCB code

057-0660Item number

NIIN 01-057-0660

Identification

Effective date	Major organizational entity	Acquisition advice code	Source of supply	Unit of issue	Unit price	Quantity per unit pack	Controlled inventory item code	Recoverability code	Management control	Net price	USC
01-OCT-2026	DA	Z	SMS	EA	$30.74	1	U	Z	Q2200X-	$0.00	A
01-OCT-2026	DF	Z	SMS	EA	$30.74	1	U	N	SF9EH-N	$0.00	F
01-OCT-2026	DN	Z	SMS	EA	$30.74	1	U		9B-----	$0.00	N
01-OCT-2026	DS	Z	SMS	EA	$30.74	1	U	N	-------	$0.00	I

Part number	CAGE	CAGE status	RNCC	RNVC	Document availability code	RNAAC	RNFC	RNSC	SADC
963-2	27318 STEWART-WARNER CORP MICROCIRCUITS DIV	H	5	9	6	TX		B
M511-043-0001	27318 STEWART-WARNER CORP MICROCIRCUITS DIV	H	E	8	5	TX
70950105-012	33322 GETRONICS GOVERNMENT SOLUTIONS LLC	A	5	2	5	TX
950105012	33322 GETRONICS GOVERNMENT SOLUTIONS LLC	A	E	8	1	TX	4	D
963FM/B	3V146 ROCHESTER ELECTRONICS LLC	A	5	2	5	TX
950105012	53178 BULL HN INFORMATION SYSTEMS INC	A	E	8	1	TX	1	B
B77T0028-5	76301 THE BOEING COMPANY DIV DEFENSE	A	E	8	1	TX
SN15863	01295 TEXAS INSTRUMENTS INCORPORATED	A	5	9	6	TX
SN15963-1	01295 TEXAS INSTRUMENTS INCORPORATED	A	E	8	3	TX
MC963BABS	04713 FREESCALE SEMICONDUCTOR, INC.	A	5	9	3	TX	4	B
MC963F	04713 FREESCALE SEMICONDUCTOR, INC.	A	5	9	6	TX
963/BABJC	04713 FREESCALE SEMICONDUCTOR, INC.	A	3	9	3	TX
MC863F	04713 FREESCALE SEMICONDUCTOR, INC.	A	E	8	3	TX	1	D
MC38510/963BABS	04713 FREESCALE SEMICONDUCTOR, INC.	A	C	1	3	TX			AF
963FC	07263 FAIRCHILD SEMICONDUCTOR CORP	A	E	8	3	TX	4	D
996359	07263 FAIRCHILD SEMICONDUCTOR CORP	A	E	8	5	TX	4	D
U3I996351X	07263 FAIRCHILD SEMICONDUCTOR CORP	A	E	8	3	TX
SL5467	07263 FAIRCHILD SEMICONDUCTOR CORP	A	E	8	5	TX
M511-043-0001	07421 L3HARRIS INTERSTATE ELECTRONICS CORPORATION	A	E	8	1	TX
9635	15238 ITT SEMICONDUCTORS A DIVISION OF INTERNATIONAL TELEPHONE AND TELEGRAPH CORP	H	E	8	5	TX	3	B
PL9963-51	15124 PHILCO-FORD CORP MICROELECTRONICS DIV	H	E	8	5	TX
MIC963-1B	14433 ITT SEMICONDUCTORS DIV	H	E	8	3	TX
MIC963-5B	14433 ITT SEMICONDUCTORS DIV	H	E	8	3	TX	3	B
ITT963-1B	14433 ITT SEMICONDUCTORS DIV	H	E	8	3	TX
NC2917	14433 ITT SEMICONDUCTORS DIV	H	E	8	5	TX

BODY LENGTH	INCHES MINIMUM 0.240 AND INCHES MAXIMUM 0.275
BODY WIDTH	INCHES MINIMUM 0.240 AND INCHES MAXIMUM 0.260
BODY HEIGHT	INCHES MINIMUM 0.030 AND INCHES MAXIMUM 0.070
MAXIMUM POWER DISSIPATION RATING	MILLIWATTS 80.0
OPERATING TEMP RANGE	CELSIUS -55.0 TO 125.0
STORAGE TEMP RANGE	CELSIUS -65.0 TO 150.0
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/BUFFERED OUTPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
INCLOSURE CONFIGURATION	FLAT PACK
OUTPUT LOGIC FORM	DIODE-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN	TRIPLE 3 INPUT
DESIGN FUNCTION AND QUANTITY	GATE, NAND 3
CASE OUTLINE SOURCE AND DESIGNATOR	JOINT ELECTRON DEVICE ENGINEERING COUNCIL T0-86
TERMINAL SURFACE TREATMENT	SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	VOLTS MAXIMUM POWER SOURCE 5.5
TIME RATING PER CHACTERISTIC	NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT 60.00 AND NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT 30.00
TEST DATA DOCUMENT	STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). 96906--IL-STD-883
TERMINAL TYPE AND QUANTITY	FLAT LEADS 14

MOE rule	MOE CD	AMC	AMSC	Date assigned	IMC	IMCA	PICA	PICA LOA	SICA	SICA LOA	Auth collab	Supp collab	Fmr MOE rl
ZJ01	ZJ			01-APR-25			ZJ	81			ZJ
ZS01	ZS			01-JAN-09			ZS	81			ZS
ZU01	ZU			01-APR-08			ZU	81			ZU
A918	DA	3	C	01-AUG-06	Z	CD	GX	01	CD	5D	CD GX	CL	A196
FXGX	DF	3	C	01-AUG-06	Z	SX	GX	01	SX	5D	GX TU		FXTX
N9BN	DN	3	C	01-AUG-06	Z	GH	GX	01	GH	5D	GX	GT HD KE	N9ND
S911	DG	3	C	01-AUG-06	Z	XN	GX	01	XN	5D	XN GX		S007

PICA SICA: P
PKG cat: 69F0
Unpackaged weight: 0.0000
Unpackaged width: 0.000
Unpackaged length: 0.000
Unpackaged height: 0.000
Intermediate container qty: AAA
Quantity set by MIL-STD-2073-1E B.5: up to 100 unit packs, a maximum net load of 40 pounds, and a maximum of 1.5...
Method of preservation: GX
Preserve by Method 41 using an approved ESD control program (see 5.2.4.1.1) as follows: Items subject to damage by...
Clng drying: 1
Any suitable process that is not injurious to the item.
Pres mat: 00
No requirement
Wrap mat: ZZ
Special requirements – see specific instructions or drawings provided
Cush dun: ZZ
Special requirements.
THK: C
3/4 inch thick
Unit cont: ZZ
Special requirement – See specific instructions or drawings provided.
PKG data source: P

PICA SICA: P
SPC MKG: ZZ
Special requirements
Inter cont: D3
PPP-B-566, PPP-B-676, or ASTM D5118/D5118M, folding, setup or fiberboard box.
Lvl A: Q
Packing shall be accomplished in accordance with table C.II for the packing level specified.
Lvl b: Q
Packing shall be accomplished in accordance with table C-II for the packing level specified.
Lvl c: U
Items or packages that require packing for acceptance by the carrier shall be packed in exterior type shipping...
Unit pack weight: 0.1000
UP SZ MAXB: 0.00000
UP SZ MAXL: 0.00000
UP SZ MAXH: 0.00000
Unit pack cube: 0.0040
OPI: M
All packaging data is mandatory for compliance and no substitutions are permitted.
Supplemental instructions: UNIT PACKAGE MARKING REQUI

Related NSN	Item standardization code	Orig stdzn dec	Dt stdzn dec
5962-00-137-4988	3	TX	14-NOV-1980
	1	TX	19-NOV-1980
	3	TX	14-NOV-1980

FSC	Cancelled NIIN	NIIN status code	Effective date	DEMIL code
5962	5962-00-184-8219	5	02-JUL-2026	Q
5962	5962-00-137-7479	5	02-JUL-2026	Q
5962	5962-00-489-5089	5	02-JUL-2026	Q
5962	5962-00-997-0330	5	02-JUL-2026	Q
5962	5962-01-083-4702	5	02-JUL-2026	Q

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